Angstrom Engineering

Covap

Compact Thermal Evaporation PVD Platform

The Covap offers a safe, reliable, and compact PVD solution for labs that need reproducible high-quality thin films. Features a hinged lid for easy access, complete removable shielding, and optional glovebox integration.

Deposition Thermal Evaporation
Sources 2–4 configurable
Chamber Hinged lid design
Integration Glovebox-ready
< 5×10⁻⁷ Torr
Base Pressure
2–4
Configurable Sources
150 mm
Max Substrate
Compact
Footprint

Designed for Your Lab

The Covap is a compact, safe, and reliable thermal evaporation system designed for labs that need high-quality thin film deposition in a small footprint.

With its hinged lid design, complete removable shielding, and optional glovebox integration, the Covap combines ease of use with research-grade performance.

Whether you're depositing metallic contacts, organic layers, or multi-layer stacks, the Covap delivers consistent results with minimal training and maintenance.

Detailed Specifications

Complete technical parameters for this product.

Parameter Specification
Deposition Method Thermal Evaporation
Number of Sources 2–4 configurable
Base Pressure < 5×10⁻⁷ Torr
Substrate Size Up to 150mm

Why Choose This Product

See how this product compares to alternatives in the market.

Specification Covap Conventional Alternative
Base Pressure < 5×10⁻⁷ Torr ~10⁻⁶ Torr
Sources 2–4 configurable 1–2 fixed

Comparison based on published specifications of similar products. Actual performance may vary by configuration.

Key Advantages

Core features that make this product stand out.

Feature Feature illustration

Safe & Reliable

Complete safety interlock system and removable shielding for effortless cleaning and maintenance.

Feature Feature illustration

Compact Footprint

Space-efficient design fits in constrained lab environments without compromising performance.

Fully Configurable

Multiple source options and process enhancements tailored to your specific deposition requirements.

Multi-Layer Capability

Sequential deposition from multiple sources without breaking vacuum.

Precise Control

QCM-based thickness monitoring with closed-loop rate control for reproducible film properties.

Easy Maintenance

Removable shielding and hinged lid design minimize downtime and simplify chamber cleaning.

Interested in this product? Get detailed specifications and pricing for your lab.

集成软件生态

从系统控制到数据分析的完整软件套件。

控制软件

直观的图形界面,实现完整的系统控制和工艺配方管理。

  • 功能特点 1
  • 功能特点 2

分析工具

内置数据处理和分析功能。

  • 功能特点 1
  • 功能特点 2

技术深度解析

深入了解这款产品背后的工程原理。

真空系统

第一段 — 产品优势与核心参数。

第二段 — 技术细节与对比。

第三段 — 对用户的实际意义。

蒸发源技术

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第二段。

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工艺控制

第一段。

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典型应用与案例

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应用案例
热蒸发

有机电子器件

OLED 制备 低温工艺

该应用的详细描述,以及产品在此场景中的表现。

核心价值:产品在此应用中的突出优势总结。
半导体
光伏与太阳能
光学镀膜
应用图片
模式

应用标题

详细信息

Ready to see this product in action? Schedule a live demo with our applications team.

Request a Quote or Demo

Our application specialists will help you find the optimal configuration for your specific requirements.

  • Response within 24 hours
  • Custom configuration advice
  • Free online demo available
  • No obligation, free consultation

Send Us Your Inquiry

Please use the contact form on our Contact page, or email us directly at [email protected] for product inquiries, pricing, and demo requests.

Frequently Asked Questions

Common questions about this product.

The Covap accommodates substrates up to 150 mm in diameter.

Yes, the Covap is designed to be glovebox-compatible with optional configuration.

About Angstrom Engineering

Angstrom Engineering designs and manufactures thin film deposition systems in Kitchener, Canada. Every system is engineered and assembled on-site by their team of experts.

ISO 9001 CE Certified 25+ Years

Ready to Get Started?

Contact our team for pricing, lead times, and technical consultation.