Angstrom Engineering
Covap
Compact Thermal Evaporation PVD Platform
- Deposition: Thermal evaporation
- Sources: 2–4 configurable
- Chamber: Hinged lid design
PVD Systems
Physical vapor deposition platforms for research and production — from compact benchtop evaporators to large-chamber multi-source sputtering systems.
Technology
Understanding PVD Sputtering
Physical Vapor Deposition (PVD) sputtering is a vacuum-based thin film deposition technique...
High Purity
Ultra-clean vacuum environment ensures contamination-free films
Precise Control
Angstrom-level thickness control with real-time monitoring
Versatile Materials
Deposit metals, oxides, nitrides, and multi-layer stacks
Low Temperature
Room-temperature to moderate heating — compatible with sensitive substrates
7 products in this category
Angstrom Engineering
Quick Comparison
Compare Products in This Category
| Model | Deposition Method | Chamber Size | Key Feature | Supplier | |
|---|---|---|---|---|---|
| Covap | Thermal Evaporation | Compact | Hinged lid, glovebox-ready | Angstrom | Inquire |
Applications
Industries & Applications
Semiconductor
Metallization, barrier layers, and interconnects for IC fabrication.
FAQ
Frequently Asked Questions
Common questions about PVD sputtering systems — answered by our engineers.
DC sputtering works with conductive targets...
Resources
Technical Resources & Downloads
Need Help Selecting the Right System?
Our technical team can recommend the best solution for your application requirements, budget, and timeline.